Electrochemical Technology CorporationDryScrub®


System Operation

® Systems use an effluent reduction process rather than the effluent dilution process employed by wet scrubbers. All spent reactive process gases exhausted from the process tool pass through the DryScrub® reactor. The electrode within the DryScrub® reactor is both the reactor and a collection chamber. This electrode consists of multi-turn, high-conductance spirals or passageways that form the primary gas flow path. These electrodes shape a uniform, high-intensity plasma through which all effluent gases must pass.

The surface areas of these electrodes are >8M
2 for the 2DX2 model, >4M2 for the standard 2D model and >2M2 for the 2DH model which all of them provide a large surface area to plasma volume ratio in which the gasses are reacted to depletion, the solids being deposited onto the electrode itself. As effluent gases pass through the DryScrub electrode, they are reacted to depletion.

A DryScrub
® reactor is installed in one of three possible vacuum-system locations, determined by the process parameters.

Surface recombination reactors strip and deposit solid components of the reacted gases on the electrode as solid dense films. As a result, mobile and other submicron particles are essentially eliminated while chemically and thermodynamically stable gases pass through the DryScrub
® reactor for safer handling in downstream equipment. Electrodes have predictable collection capacities and are replace during planned maintenance periods.

The design of DryScrub® Systems is elegant in its simplicity. It employs the same basic CVD technology used in the production of many semiconductor devices. It offers proven operating reliability and safe disposal of residual waste.


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